Enhanced adhesion of H-resin derived silica to gold
US5616202A · kind A · utility
3Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 1995 |
| Grant date | Apr 1, 1997 |
| Priority date | — |
| Expiry date | Jun 26, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49163
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a method of increasing the adhesion between gold and silica derived from hydrogen silsesquioxane resin. The method comprises joining the gold and silica followed by annealing under an oxidizing atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.