Method for direct-electroplating an electrically nonconductive substrate
US5616230A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 1995 |
| Grant date | Apr 1, 1997 |
| Priority date | — |
| Expiry date | Jan 20, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/424
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for plating an electrically nonconductive substrate by the following sequence of steps: PA1 (1) a step of treating an electrically nonconductive substrate with a solution containing a silane coupling agent; PA1 (2) a step of treating the electrically nonconductive substrate from said step (1) with a solution containing an anionic surfactant; PA1 (3) a step of the electrically nonconductive substrate from said step (2) with a solution containing a palladium compound and at least one nitrogen-containing sulfur compound selected from among thiourea and its derivatives; PA1 (4) a step of treating the electrically nonconductive substrate from said step (3) with a reducing solution containing at least one member selected from among sodium borohydride, sodium hypophosphite, hydrazine, dimethylaminoborane, hydroxylamine and glyoxylic acid; and PA1 (5) a step of forming an electroplating layer on the electrically nonconductive substrate from said step (4). With this process, improved productivity is obtained through process simplification, reduced treating time and improved working environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.