Liquid epoxy resin composition
US5616633A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1994 |
| Grant date | Apr 1, 1997 |
| Priority date | — |
| Expiry date | Sep 9, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/36
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a liquid epoxy resin composition that includes an epoxy resin, at least one filler and an inorganic thixotropic agent in an amount effective to reduce settling of said filler at ambient temperatures. The composition further includes a polymer powder that dissolves in and thickens the composition when the composition is heated. The polymer powder is added in an amount effective to reduce settling of said filler at temperatures up to the gelling temperature of the composition. The thixotropic agent is added in an amount that the resulting epoxy resin composition is a free-flowing liquid. The composition may optionally further include a curing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.