Method and apparatus for compensation of micromachined sensors
US5616864A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1995 |
| Grant date | Apr 1, 1997 |
| Priority date | — |
| Expiry date | Feb 22, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01C19/5684
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A yaw rate sensor having a vibrating ring microstructure surrounded by electrodes capacitively coupled to the ring has vibration responsive circuits with inputs connected to several of the sensors, the circuits having outputs connected to others of the electrodes for driving or influencing the vibration. The circuits produce a main drive voltage to excite the ring to resonance, a feedback drive voltage to provide force-to-rebalance correction, and a dc compensation voltage to tune the ring to a single resonance frequency. An economy of electrode space is achieved by using some electrodes for more than one function, e.g. feedback and compensation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.