Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board
US5617294A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1995 |
| Grant date | Apr 1, 1997 |
| Priority date | — |
| Expiry date | Sep 29, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for removing heat from an integrated circuit package. In one embodiment, the present invention includes a heat slug that is capable of being installed within an opening in a printed circuit board using a standard pick-and-place machine. The surface mountable heat slug includes a top portion and a bottom portion, wherein the bottom portion is formed to fit within the printed circuit board opening. The top portion of the heat slug is attached to the top surface of the printed circuit board. The integrated circuit package is attached to the bottom portion of the heat slug which is exposed along the bottom surface of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.