Wideband solderless right-angle RF interconnect
US5618205A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 1994 |
| Grant date | Apr 8, 1997 |
| Priority date | — |
| Expiry date | Oct 17, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2103/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solderless right-angle interconnect is provided for achieving flexible, low-profile and enhanced performance high frequency signal interconnections. The interconnect includes a compressible conductive pin assembly which has a first end electrically coupled to a first transmission path and a second end electrically coupled to a stripline circuit trace which provides a second transmission path. According to one embodiment, a springy compressible conductive button is located in a recessed chamber at the second end of the conductive pin and partially extends from the end thereof. According to another embodiment, a springy conductive bellows is formed intermediate the first and second ends of the pin assembly. The second end of the conductive pin further includes at least one tapered edge. A conductive ground layer is further provided for substantially enclosing the interconnect and providing a ground reference thereabout. In a first embodiment, the conductor forming the first transmission path includes a coaxial cable coupled to the conductive pin. In a second embodiment, the first transmission path may include a second stripline circuit trace, in which the first end of said conducti…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.