Aluminum-based solder material

US5618357A · kind A · utility

Assignee

• Daimler-Benz Aerospace Airbus GmbH · DE

Inventors

• Peter Knepper · Ganderkesee, DE
• Olaf Scheffler · Bremen, DE

Key dates

• Filing date: Jun 22, 1995
• Grant date: Apr 8, 1997
• Expiry date: Jun 22, 2015

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K35/286
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A solder material that is especially suitable for the fluxless hard soldering of aluminum-based components consists of an aluminum-based alloy that especially contains about 10 to 50 wt. % of germanium, about 1 to 12 wt. % of silicon, about 0.1 to 3 wt. % of magnesium, and about 0.1 to 3 wt. % of indium. The solder material is useful at soldering temperatures in the range from 424.degree. to about 600.degree. C., and is therefore especially suitable for the fluxless hard soldering of components made of precipitation-hardened high-strength aluminum-based materials.