Electroplating process
US5618400A · kind A · utility
2Cited by
6References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1995 |
| Grant date | Apr 8, 1997 |
| Priority date | — |
| Expiry date | Sep 19, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an unstable aqueous dispersion essentially free of a dispersing agent using physical dispersion means to maintain the stability of the dispersion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.