Hinged circuit assembly with multi-conductor framework
US5619012A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1993 |
| Grant date | Apr 8, 1997 |
| Priority date | — |
| Expiry date | Dec 10, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A circuit assembly is made by overmolding, with an electrically insulating material, a unitary framework of electrically conductive material forming coplanar conductors which are connected to each other by an integral structural member. The overmolded material secures the conductors relative to each other and enables portions of the structural member to be severed, electrically isolating the conductors from each other. The overmolded material also positions electrical components having leads that are electrically connected to the conductors. Ends of the conductors are formed into terminals which extend out of a hinge formed in the overmolded material. The hinge enables the terminals to be oriented in a different plane than the conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.