Reduced inter-module circuit path crossovers on circuit boards mounting plural multi-chip modules, through rearranging the north-south-east-west interconnection interfaces of a given module and through selective rotation of each module
US5619719A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 1996 |
| Grant date | Apr 8, 1997 |
| Priority date | — |
| Expiry date | Jul 11, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/141
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The number of circuit path crossover points on boards mounting plural connected multichip modules is substantially reduced over the number that would otherwise be required. For 4-sided modules and boards, the modules are arranged on the board in such a way that their inter-connecting north-east-south-west ports are successively reordered to N-S-E-W. Additionally, further advantage in reducing crossover vias may be gained by combining the reordering with a phased rotation of the modules from their nominal congruent board position. For the 4-sided module, these expedients virtually eliminate crossover vias between the east and west ports. It also provides for all MCMs a ready common bus structure located at a common interior area of the mounting board, to which the E- and W-ports are oriented. The invention is applicable to a class of multi-sided, multi-chip modules on boards with a like number of sides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.