Packaging material with an opening arrangement and a method of producing same
US5620550A · kind A · utility
21Cited by
17References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1994 |
| Grant date | Apr 15, 1997 |
| Priority date | — |
| Expiry date | Sep 19, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1062
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A packaging material for producing packages includes a foundation layer that is provided with a through hole. A thermoplastic strip covers the through hole and an outer layer completely covers the thermoplastic strip and foundation layer. Various other layers can also be laminated to the foundation layer. When the thermoplastic strip is torn off, the various other layers accompany the thermoplastic strip, thereby exposing the through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.