Platinum plating bath
US5620583A · kind A · utility
6Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1996 |
| Grant date | Apr 15, 1997 |
| Priority date | — |
| Expiry date | Mar 27, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Crack-free, bright platinum layers with thicknesses of more than 100 .mu.m are obtained from electroplating baths which contain 5 to 30 g/l platinum as amminesulphamato complex and 20 to 400 g of a strong acid if the content of free amidosulphuric acid amounts to less than 5 g/l.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.