Semiconductor package having support film formed on inner leads
US5621242A · kind A · utility
10Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 1996 |
| Grant date | Apr 15, 1997 |
| Priority date | — |
| Expiry date | Jun 5, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16245
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thin semiconductor package having a support film formed on an upper surface of the inner leads with a thickness approximately equal to the thickness of a portion of the molding compound overlaying the inner leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.