Method and apparatus for measuring the temperature of an object, in particular a semiconductor, by ellipsometry
US5624190A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1995 |
| Grant date | Apr 29, 1997 |
| Priority date | — |
| Expiry date | Jul 26, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/065
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of measuring the surface temperature of an object. The method includes performing ellipsometric measurements on the object in order to determine at least first and second photon energies (E.sub.1, E.sub.2) for an electromagnetic beam at which measurements are respectively substantially independent of temperature and dependent on temperature. The method further includes creating and directing to the object, an electromagnetic incident beam including at least the first and second photon energies (E.sub.1, E.sub.2). The change in polarization at the first photon energy (E.sub.1) is measured and the thickness of the layer of material is determined on the basis of this measurement. The surface temperature of the object can then be determined on the basis of the measured change in polarization at the second photon energy (E.sub.2) of the beam, while taking account of the thickness of the layer of material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.