Diamond-based ultra-high-pressure-sintered material having excellent chipping resistance, cutting tool made therefrom, and method of manufacturing the cutting tool
US5624756A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1994 |
| Grant date | Apr 29, 1997 |
| Priority date | — |
| Expiry date | Dec 22, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A cutting tool blank formed of material having a composition comprising of 0.1 to 20 wt % of BaCO.sub.3 and/or MgCO.sub.3, and/or 0.05 to 10 wt % of CaMg(CO.sub.3).sub.2 or CaCO3, the balance being preferably substantially diamond forming a matrix is heated and maintained at a temperature of 800.degree. to 1400.degree. C. in a vacuum to change, by chemical reaction, the above BaCO.sub.3 and/or MgCO.sub.3, and/or CaMg(CO.sub.3).sub.2 or CaCO.sub.3 into 0.05 to 13% of BaO and/or MgO and/or 0.02 to 5% of CaO, and to form pores. In this manner, a cutting tool formed of a diamond-based ultra-high-temperature-sintered material having a structure in which BaO, MgO and/or CaO are distributed finely and uniformly in a diamond matrix is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.