Method of manufacturing thick-film resistor elements
US5624782A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 1995 |
| Grant date | Apr 29, 1997 |
| Priority date | — |
| Expiry date | May 11, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/283
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
To provide a method of manufacturing thick-film resistor elements that forms thick-film resistors having a uniform thickness on a substrate surface with high precision. A method of manufacturing thick-film resistor elements by applying a thick-film resistor composition, obtained by dispersing a conductive component and an inorganic binder in an organic medium and which has a specified rheology, through a clear relief image obtained by exposing, curing, and developing a resist layer of a photopolymerizable mixture formed on an insulating substrate according to the resist pattern, and the thick-film paste obtained at this time has almost the same thickness as the photopolymerizable layer on the surface of the insulating substrate and is patterned according to the high-precision pattern defined by the sharp, linear, lateral edge enclosed by the resist image removed by development.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.