Patent · US Expired

Semiconductor device having capacitor and manufacturing method thereof

US5624864A · kind A · utility

51Cited by
12References
1Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 4, 1994
Grant dateApr 29, 1997
Priority date
Expiry dateAug 4, 2014

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S438/958

Abstract

A semiconductor device forming a capacitor through an interlayer insulating layer on a semiconductor substrate on which an integrated circuit is formed. This semiconductor device has an interlayer insulating layer with moisture content of 0.5 g/cm.sup.3 or less, which covers the capacitor in one aspect, and has a passivation layer with hydrogen content of 10.sup.21 atoms/cm.sup.3 or less, which covers the interconnections of the capacitor in other aspect. By thus constituting, deterioration of the capacitor dielectric can be prevented which brings about the electrical reliability of the ferroelectric layer or high dielectric layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.