Heat sink fin assembly for cooling an LSI package
US5625229A · kind A · utility
48Cited by
4References
32Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 3, 1995 |
| Grant date | Apr 29, 1997 |
| Priority date | — |
| Expiry date | Oct 3, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink fin assembly of the corrugated type for cooling an LSI package comprises a flat base plate and a heat dissipating member made of a thin metal sheet having convex and concave portions which are comprised of a repeated series of side wall portions, top portions, and bottom portions. The base plate and the heat dissipating member are integrated with each other by bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.