Linkage drive mechanism for ultrasonic wirebonding
US5626276A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 1996 |
| Grant date | May 6, 1997 |
| Priority date | — |
| Expiry date | Mar 14, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultrasonic wirebonding assembly, consisting of an actuator producing vibrations at an ultrasonic frequency and a tip transmitting such vibrations to a bonding wire atop a terminal to which the wire is to be bonded, is moved among positions on a circuit chip where wirebonding operations are to occur by means of a linkage. The linkage consists of first and second drive arms, each of which is pivoted on a single stationary shaft, a drive link pivoted on the second drive arm, and a connecting link extending between the drive link and the first drive arm, being pivoted at each end. Each arm is independently driven using a motor having a coil moving over an arcuate permanent magnet. The wirebonding assembly is driven vertically, downward in a direction of engagement with the workpiece and upward in a direction of disengagement with the workpiece, on the drive link by means of a linear motor. The rapid movements available from this linkage facilitate the use of an incrementally moving conveyer holding a number of circuit chips on which wirebonding operations are to be performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.