Mounting apparatus of solder-balls
US5626277A · kind A · utility
46Cited by
4References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 18, 1995 |
| Grant date | May 6, 1997 |
| Priority date | — |
| Expiry date | Aug 18, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder-ball mounting apparatus is provided with a ball feed jig having a ball tank that may receive a predetermined number of solder-balls for feeding the solder-balls to a ball suction jig through a guide mask mounted on an opening portion of the ball tank, and blowout holes formed in a bottom of the ball tank for a blow gas as a blow unit for agitating the solder-balls received in the ball tank in the ball feed jig. The solder-balls may be positively sucked to ball suction holes one by one without turning over the ball suction jig.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.