Electroplating process
US5626736A · kind A · utility
17Cited by
6References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1996 |
| Grant date | May 6, 1997 |
| Priority date | — |
| Expiry date | Jan 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0353
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for electroplating a metal clad substrate by forming a sacrificial coating over the metal cladding and then coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is contacted with an etchant for the sacrificial coating to undercut the carbonaceous coating and facilitate its removal from areas where plating is undesired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.