Binder for use in metal powder injection molding and debinding method by the use of the same
US5627258A · kind A · utility
29Cited by
5References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1995 |
| Grant date | May 6, 1997 |
| Priority date | — |
| Expiry date | Mar 13, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
By the use of a binder comprising (a) 40 to 70 wt % of a water-soluble amide material and/or water-soluble amine material and (b) 25 to 60 wt % of a polyamide resin component substantially composed of a polyamide resin material having 10 carbon atoms or more on average between amido groups, a molded article is produced by metal powder injection molding. From such a molded article, the water-soluble amide material and/or water-soluble amine material is eluted by a water-based solvent and then, the polyamide resin component is removed by heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.