Patent · US Expired

Printed circuit board assembly for high speed data transfer

US5627730A · kind A · utility

10Cited by
18References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 26, 1996
Grant dateMay 6, 1997
Priority date
Expiry dateFeb 26, 2016

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/10719
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A printed circuit board assembly which includes a two-dimensional array of connectors to provide significantly higher data transfer rates than typical one-dimensional connectors, without sacrificing board space. The assembly preferably includes a plurality of connection pads on each printed circuit board. An anisotropically conducting material is placed between the connection pads and the boards pressed together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.