Printed circuit board assembly for high speed data transfer
US5627730A · kind A · utility
10Cited by
18References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1996 |
| Grant date | May 6, 1997 |
| Priority date | — |
| Expiry date | Feb 26, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10719
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly which includes a two-dimensional array of connectors to provide significantly higher data transfer rates than typical one-dimensional connectors, without sacrificing board space. The assembly preferably includes a plurality of connection pads on each printed circuit board. An anisotropically conducting material is placed between the connection pads and the boards pressed together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.