Halogen tin composition and electrolytic plating process
US5628893A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 24, 1995 |
| Grant date | May 13, 1997 |
| Priority date | — |
| Expiry date | Nov 24, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition of matter for electrolytically depositing a tin layer on an iron containing-substrate is disclosed comprising an acidic aqueous mixture of: PA1 (a) a stannous tin halide; and PA1 (b) a salt having PA2 (1) an alkaline cation, and PA2 (2) an oxygen-containing inorganic acid anion reducible to a lower oxidation state. The salt is selected to minimize oxidation of Sn (II) to Sn (IV). An electrolytic cell for electrolytically depositing a tin layer on an iron-containing substrate is also disclosed, where the cell has an electrolyte comprising the foregoing composition. The overall cell potential of the cell is decreased, and the free energy increased, compared to an electrolytic cell without the salt. A process is disclosed for depositing a tin layer on an iron containing substrate comprising electrolytically coating the substrate with the composition, or coating the substrate employing the foregoing electrolytic cell. A product made by any of the foregoing processes is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.