Device for pressurizing a plate bundle, especially for a plate heat exchanger
US5630475A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Apr 28, 1995 |
| Grant date | May 20, 1997 |
| Priority date | — |
| Expiry date | Apr 28, 2015 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2265/12
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A device for pressurizing a plate bundle which is arranged in a leakproof vessel (2) and comprises a stack of plates which are parallel to one another to form a first circulation circuit for a first fluid under pressure and a second circulation circuit for a second fluid under pressure. The device includes a first conduit (15) for connecting the vessel (2) to the delivery (10) of the first fluid continuously feeding the vessel (2), a second conduit (16) for connecting the vessel (2) to the delivery (12) of the second fluid feeding the vessel (2) in the event of stoppage of the delivery of the first fluid, and controls (20) for feeding of the vessel (2) with the second fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.