Soldering apparatus with abrupt separation of solder streams
US5630542A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 5, 1994 |
| Grant date | May 20, 1997 |
| Priority date | — |
| Expiry date | Dec 5, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2027
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a soldering apparatus, comprising a solder vessel; at least one soldering tower located in said solder vessel; transport means for transporting objects to be soldered over said soldering tower; solder wave generating means for generating a solder wave emerging from the apex of the soldering tower and contacting the objects to be soldered, the soldering tower comprising a weir such that at least a part of the solder wave flows parallel to the direction of movement of the objects to be soldered over said weir; and guide means for guiding said part of the solder wave such that the solder wave leaves the soldered object substantially abruptly. As a consequence of said feature the stream of solder is abruptly guided away from the printed circuit board, so that the possibilities for developing short circuits on the printed circuit board are substantially reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.