Magnetic sensor with encapsulated magnetically sensitive component and magnet
US5631557A · kind A · utility
106Cited by
8References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 16, 1996 |
| Grant date | May 20, 1997 |
| Priority date | — |
| Expiry date | Feb 16, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P3/488
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A magnetic sensor is provided in which a flexible substrate is used to support a magnetically sensitive component and other electronic components relative to the position of a permanent magnet. A thermoset material is used as an encapsulant to form a solid magnetic sensor in which the magnetically sensitive component, the permanent magnet and a portion of the flexible substrate are encapsulated within the thermoset material after it solidifies. A portion of the flexible substrate extends from an end of the solidified encapsulant to permit electrical connection to other components and devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.