Electronic circuit structure with aperture suspended component
US5631807A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 20, 1995 |
| Grant date | May 20, 1997 |
| Priority date | — |
| Expiry date | Jan 20, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4274
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An electronic circuit structure having a reduced size includes a circuit substrate, an aperture extending through the circuit substrate, and an electronic component suspended within the aperture. The suspension of the electronic component within the aperture significantly reduces the profile of the overall electronic circuit structure. The aperture further enables electronic components to be mounted in a partially overlapping fashion to reduce the surface area of the electronic circuit structure. The electronic circuit structure can make use of standard FR-4, G-10, or ceramic circuit substrates or multilayer flex circuits, as well as electronic components in the form of standard leaded integrated circuit packages. The mounting of the electronic component within the aperture of the circuit substrate provides an advantage of assisting in heat dissipation. The incorporation of mesh-like voltage and ground planes can further aid in heat dissipation and provide electrical isolation and capacitive filtering. In addition, the electronic circuit structure facilitates high density packaging of several electronic structures, for example, in a stacked or radial configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.