Process for forming a circuit assembly

US5633034A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Kenneth Raymond Carter · San Jose, US
• Richard Anthony DiPietro · San Jose, US
• James L. Hedrick · Pleasanton, US
• John P. Hummel · Millbrook, US
• Robert D. Miller · San Jose, US
• Martha I. Sanchez · Menlo Park, US
• Willi Volksen · San Jose, US
• Do Yeung Yoon · Seoul, KR

Key dates

• Filing date: May 9, 1996
• Grant date: May 27, 1997
• Expiry date: May 9, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/4676
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention relates to a process for forming a circuit assembly comprising (i) coating onto a substrate a layer of polyamic ester selected from a unique class of polyamic esters; (ii) imidizing the polyamic ester to form a layer of polyimide having an even surface and (iii) forming circuit conductors on the even surface of the polyimide.