Multiple dip coating method
US5633046A · kind A · utility
12Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 1995 |
| Grant date | May 27, 1997 |
| Priority date | — |
| Expiry date | May 22, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G5/0525
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is disclosed a dip coating method for fabricating a photosensitive member comprising: (a) dipping a substrate into a coating solution comprised of a photosensitive material and raising the substrate, thereby depositing a coating of the photosensitive material on the substrate; and (b) dipping the substrate in the same coating solution and raising the substrate, thereby increasing the thickness of the coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.