Photoresist composition and article containing 1,2-quinonediazide and an organic phosphorous acid compound
US5633111A · kind A · utility
6Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1992 |
| Grant date | May 27, 1997 |
| Priority date | — |
| Expiry date | Oct 30, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07C309/73
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A positive type or negative type photoresist composition for fine processing having excellent resolution, sensitivity, adhesive-ness and developability comprising: (a) an alkali soluble resin or a resin having anti-alkali dissolution groups in the molecules thereof, (b) a light-sensitive compound, and (c) at least one organic compound selected from the group consisting of organic phosphorus acid compounds and esters thereof in an amount of 0.001 to 10% by weight based on a weight of the resin. In addition, the present invention is directed to an etching method utilizing the positive type or negative type photoresist composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.