Lead frame and process of producing such a frame
US5633205A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1995 |
| Grant date | May 27, 1997 |
| Priority date | — |
| Expiry date | Aug 11, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame includes a plurality of inner leads, each of the inner leads having at least one surface defining a bonding area and two opposed side edges. The tip ends of the plurality of inner leads are connected by a connecting part so that the inner leads are arranged side by side with respect to each other. The connecting part is integrally and simultaneously formed with the inner leads by an etching process. Each of the inner leads has recesses on the two side edges at a position, between the bonding area and the connecting part, on a cutting line along which the plurality of inner leads are to be cut and separated into individual inner leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.