Composite diamond wire die
US5634369A · kind A · utility
1Cited by
16References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1995 |
| Grant date | Jun 3, 1997 |
| Priority date | — |
| Expiry date | Jul 7, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21C3/025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A composite diamond wire die for drawing wire has a single crystal or HTHP diamond substrate and a CVD layer or layers deposited thereon. The wire die bore extends through both the substrate and the CVD layers, with the wire bearing surface being located within the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.