Method for aligning and assembling spaced components
US5634585A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 23, 1995 |
| Grant date | Jun 3, 1997 |
| Priority date | — |
| Expiry date | Oct 23, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2329/8625
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for aligning and bonding spaced components, such as a baseplate and a faceplate of a field emission display, is provided. The method includes: providing an optical alignment tool suitable for flip chip bonding; calibrating the tool to simulate a desired spacing in the assembled components; aligning the components using the calibrated tool; bringing the aligned components towards one another using the calibrated tool; and then bonding the components together with the desired spacing therebetween. The method of the invention can be practiced with an aligner bonder tool calibrated to eliminate a parallax error. A spacer element placed between the bondheads of the tool can be used to simulate the desired spacing during calibration. Alternately the spacing during calibration can be simulated by measuring with a caliper or other instrument.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.