Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US5635754A · kind A · utility
45Cited by
5References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 1995 |
| Grant date | Jun 3, 1997 |
| Priority date | — |
| Expiry date | Jan 13, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose the integrated circuit die within, wherein the lid and the base are each constructed from a high-Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high-Z material disposed between the integrated circuit die and a base, in combination with a high-Z material lid to substantially block incident radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.