Head assembly controlling distortion due to temperature variation and disk apparatus using the head assembly
US5636088A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1994 |
| Grant date | Jun 3, 1997 |
| Priority date | — |
| Expiry date | Nov 23, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/5565
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The dimension ratio t/H of the thickness t of a flexure spring to the height (thickness) H of a slider 17 is set at 0.047 or less in order to reduce the variation in crown amount due to a temperature variation. As the ratio of the thickness t of the flexure spring to the height H of the slider decreases, the stress acting in the slider due to a difference in linear expansion coefficient between itself and the flexure spring decreases and the rigidity of the slider increases relative to the flexure spring. The dimension ratio H/L of the height H of the slider to the length L thereof is set at 0.245 or more. As the dimension ratio H/L increases, the rigidity of the slider increases and the amount of deformation of the slider due to a difference in linear expansion coefficient between itself and the flexure spring decreases. In addition, the ratio A2/A1 of an actual adhesion area A2 between the slider and a slider fixing portion of the flexure spring to a possible adhesion area A1 therebetween is reduced to 0.42 or less. Moreover, a temperature compensation member is adhered to the slider or the flexure spring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.