Composite diamond wire die
US5636545A · kind A · utility
4Cited by
16References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1995 |
| Grant date | Jun 10, 1997 |
| Priority date | — |
| Expiry date | Jul 7, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21C3/025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A composite diamond wire die for drawing wire has a single crystal or HTHP diamond substrate and a CVD layer or layers deposited thereon. A wire die bore extends through the substrate and between the CVD layers, with a wire bearing surface being located completely within the substrate. The CVD layers may be deposited so as to develop tensile stress therein, so as to place the substrate in compression.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.