Systems for performing chemical mechanical planarization and process for conducting same
US5637185A · kind A · utility
88Cited by
7References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1995 |
| Grant date | Jun 10, 1997 |
| Priority date | — |
| Expiry date | Mar 30, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for performing chemical mechanical planarization for a semiconductor wafer includes a chemical mechanical polishing system including a chemical mechanical polishing slurry. The system also includes a device for measuring the electrochemical potential of the slurry during processing which is electrically connected to the slurry, and a device for detecting the end point of the process, based upon the electrochemical potential of the slurry, which is responsive to the electrochemical potential measuring device. Accurate in situ control of a chemical mechanical polishing process is thereby provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.