Package for a flat electrochemical device
US5637418A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 1996 |
| Grant date | Jun 10, 1997 |
| Priority date | — |
| Expiry date | Feb 8, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A package for a flat electrochemical device comprises a flexible circuit board. Building from a base layer (62), the flexible circuit board has a conductor layer disposed on the outermost side of the base layer providing a first and second contact portion (56 and 58), a cover coat layer (50) is disposed over the conductor layer and the base layer over the outermost side of the base layer, a first collector (64) is disposed on the first half (47) on the innermost side of the base layer, and a second collector (66) is disposed on the second half (48) on the innermost side of the base layer. The first collector is electrically connected to a runner by a first plated through-hole (70), and the second collector is electrically connected to the second contact portion through a second plated through-hole (72). And finally, a fringe portion (68) is provided by the base layer about the periphery of the first and second halves. Upon assembly, an electrochemical cell stack is place on one half of the circuit board, the other half is folded over the cell stack, and the fringe portion of the first half is sealed to the fringe portion of the second half.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.