Method of fabricating an air-filled waveguide on a semiconductor body
US5637521A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1996 |
| Grant date | Jun 10, 1997 |
| Priority date | — |
| Expiry date | Jun 14, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P11/002
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method of using layers of gold metallization and a thick film coating of photo-sensitive material to form an air-filled microwave waveguide structure on the outer surface of a semiconductor body, such as a monolithic microwave integrated circuit commonly referred to as an MMIC, so that the waveguide can be coupled to the active and passive devices of the MMIC. First, a patterned metallization layer is formed on a substrate. A mold of a waveguide is fabricated by masking and then etching another metallization layer. The mold is turned over face down on the patterned metallization layer and bonded to the patterned metallization layer, Then, any unnecessary material is etched away.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.