Multilayer circuit substrate and method for forming same
US5637834A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1995 |
| Grant date | Jun 10, 1997 |
| Priority date | — |
| Expiry date | Feb 3, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer circuit substrate (500 ) includes at least two substrate layers (130, 150). The first substrate layer (130) has an insulating material (100) with two opposing surfaces (101, 102), and a hole (105) extending between the two surfaces (101, 102). A conductive pattern (110) is formed on a first surface (101) of the insulating material (100) and completely covers the hole (105). The second substrate layer (150) is attached along the second surface (102) of the insulating material (100), and also includes a conductive pattern (155) on insulating material. A conductive material (140) is disposed within the hole (105) that engages the first and second conductive patterns (110, 155).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.