Leadframe semiconductor integrated circuit device using the same and method of and process for fabricating the two
US5637913A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 22, 1994 |
| Grant date | Jun 10, 1997 |
| Priority date | — |
| Expiry date | Sep 22, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.