Heat exchange assembly
US5638900A · kind A · utility
95Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1995 |
| Grant date | Jun 17, 1997 |
| Priority date | — |
| Expiry date | Jan 27, 2015 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2240/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat exchange assembly including at least one plate, preferably made from profile board, having a plurality of channels therein for the flow of a heat exchange fluid in a first plane which may be flat or curved and at least one inlet and outlet angled up to 90.degree. with respect to the first plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.