Method of cleaning brushes used in post CMP semiconductor wafer cleaning operations
US5639311A · kind A · utility
54Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Jun 17, 1997 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B7/0028
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of cleaning brushes used in post chemical-mechanical polishing of semiconductor wafers employs water blanks treated with a hydrofluoric acid to render the surface hydrophobic. When an undesirable amount of cleaning residue builds up brushes, the treated wafer blanks are passed between brushes to attract and remove the residue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.