Resin-impregnated fabric sheet
US5639544A · kind A · utility
2Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 1994 |
| Grant date | Jun 17, 1997 |
| Priority date | — |
| Expiry date | Nov 29, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2982
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a sheet wherein a fabric sheet (A) is impregnated with a resin composition (B) containing poly-p-phenylene sulfide as a major component, by controlling the orientation degree of the resin composition (B) within the range between 0.3 and 0.9, heat resistance, thermal dimensional stability, dielectric characteristics and mechanical properties when bent are largely improved, so that the resin-impregnated fabric sheet may suitably be used as an insulation substrate for circuit boards and for multilayer wiring boards to which high densification of the circuits and decrease in the thickness are demanded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.