Insulating resin-coated bonding wire
US5639558A · kind A · utility
15Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 1995 |
| Grant date | Jun 17, 1997 |
| Priority date | — |
| Expiry date | Mar 6, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a bonding wire having a good bonding property, no damage sustained to coatings during bonding, and capability of retaining an excellent insulating property even when wires come into impact with one another in the resin molding step, characterized in that the resin has a thermal weight loss at a temperature of 110.degree. C. in air of not less than 85% and an tensile strength at 180.degree. C. of not less than 300 kgf/cm.sup.2. The resins satisfying the specified characteristic conditions can be selected from the group consisting of polyparabanic acid based resins and polyarylate resins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.