Cooling structure for integrated circuit element modules, electronic device and heat sink block
US5640046A · kind A · utility
32Cited by
2References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 1995 |
| Grant date | Jun 17, 1997 |
| Priority date | — |
| Expiry date | May 1, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a cooling structure for cooling circuit element modules that are mounted on a circuit board and has heat sinks, there are provided a main duct to which the circuit element modules are connected, and a coolant supplying device which is connected to the main duct and supplies a coolant to the main duct.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.