Interconnection structure of electronic parts
US5640052A · kind A · utility
97Cited by
7References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 3, 1996 |
| Grant date | Jun 17, 1997 |
| Priority date | — |
| Expiry date | May 3, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interconnection structure is provided which is simple in structure and is easily manufactured and in which stress generated in solder bumps is minimized. Pads of a semiconductor chip and pads of a substrate are connected to each other by solder bumps. The solder bumps are hourglass-shaped. Metal core members are provided in the solder bumps, respectively. The core member is constituted with a circular bottom portion and a circular pin portion. The core member is soldered to the pad of the semiconductor chip by solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.