Diamond-like carbon encapsulation of magnetic heads
US5640292A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 1996 |
| Grant date | Jun 17, 1997 |
| Priority date | — |
| Expiry date | Jan 17, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin film magnetic transducer supported on a substrate includes a coil that terminates at pads supported on the substrate. A layer of diamond-like carbon material encapsulates the head, substrate and coil, but not the pads. A thin layer of diamond-like carbon is deposited over the exposed portions of the transducer, coil and substrate. Three techniques are described for exposing the pads including employing a photoresist mask, depositing an adhesive layer of silicon over the conductive paths but not the pads, and using a photoresist mask to etch the diamond-like carbon layer over the pads and breaking down the silicon adhesive layer with a design voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.