Patent · US Expired

Electrofluidic standard module and custom circuit board assembly

US5640995A · kind A · utility

182Cited by
63References
37Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 14, 1995
Grant dateJun 24, 1997
Priority date
Expiry dateMar 14, 2015

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T137/87885
  • WIPO fieldMechanical elements
  • WIPO sectorMechanical engineering

Abstract

A miniature electrofluidic module is disclosed, for receiving one or more fluids and for receiving an electrical connection. In accordance with one aspect of the invention, the module includes a substantially flat fluidic manifold layer for fluid distribution, a substantially flat electrical layer including an electrical circuit, and a substantially flat device layer including micromachined devices. The devices may include electrically actuated valves for modulating the flow of fluids. In another aspect of the invention, an electrofluidic module is combined with an electrofluidic circuit board. In a further aspect, an electrofluidic system such as a dialysate handling system is disclosed, including a fluidic fixture and an electrofluidic assembly incorporating electrofluidic devices. In a still further aspect of the invention, a method is disclosed for interfacing micromachined devices to electrical and fluidic interfaces on a fixture, including packaging the devices into a module and providing electrical and fluidic interfaces between the module and the fixture.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.